Hermetic Packaging Market To Gain Demand Quickly Due To Increasing Application Scope From Healthcare & Aeronautics & Space Application Till 2025: Grand View Research, Inc.
The global hermetic packaging market is
expected to reach USD 5.03 billion by 2025, according to a new report by Grand
View Research, Inc. Utilization of hermetic packages is expected to grow
significantly as a result of increasing application scope from healthcare and
aeronautics & space application.
The capability of the product to
protect electronic components from temperature, pressure, and liquids is
expected to drive the market over the forecast period. The telecom industry
utilizes fragile & complex materials in various applications such as trunk
lines and metros which require efficient packaging, thereby augmenting the
demand.
Central & South America
accounted for a share of over 5.0% in 2016 Growing population and rising
consumer willingness to spend is expected to increase the demand for electronic
devices, thereby having a positive impact on the hermetic packaging industry.
In addition, high military expenditure of USD 24.6 billion by Brazil in 2015 is
likely to drive the market growth further.
Browse full research report on Hermetic Packaging Market: http://www.grandviewresearch.com/industry-analysis/hermetic-packaging-market
Further key findings from the report suggest:
- Reed glass segment accounted for a market share of
over 7.0% in 2016 due to increasing utilization in reed switches in
automobile and aeronautics & space
- Aeronautics & space application is expected to
witness significant growth due to increasing investment in space research
across various regions
- Healthcare application accounted for a share of over
10.0% in 2016 as a result of increasing usage of hermetically packed medical
implants such as pacemakers and monitoring devices
- Middle East & Africa is anticipated to grow at a
CAGR of over 5.0% from 2017 to 2025 on account of increasing global
tension, which is fueling the defense expenditure, particularly in Saudi
Arabia and UAE
- Hermetic packaging market is characterized by
presence of large number of players and extensive R&D in order to
develop efficient products. Material technology is also expected to play a
major role in development of the market over the forecast period.
- In February 2017, Amkor acquired Nanium S.A, a
semiconductor packaging, assembly, and testing company. The acquisition
supported Amkor to strengthen its business position in wafer level
packaging of electronics. In May 2017, Kyocera launched ceramic based RFID
package with an embedded antenna which strengthened the company’s business
position in the hermetic packaging sector.
Browse more reports of this category by Grand View
Research: http://www.grandviewresearch.com/industry/semiconductors
Grand View Research has segmented the global hermetic
packaging market on the basis of product, application, and region:
Hermetic Packaging Product Outlook (USD Million,
2014 - 2025)
- Ceramic
to Metal Sealing
- Glass
to Metal Sealing
- Transponder
Glass
- Reed
Glass
- Passivation
Glass
Hermetic Packaging Application Outlook (USD Million,
2014 - 2025)
- Aeronautics
& Space
- Military
& Defense
- Automotive
- Healthcare
- Telecom
- Others
Hermetic Packaging Regional Outlook (Revenue, USD
Million, 2014 - 2025)
- North
America
- U.S.
- Europe
- Germany
- France
- Asia
Pacific
- China
- Japan
- Central
& South America
- Brazil
- Middle
East & Africa
Access Press Release
By Grand View Research: http://www.grandviewresearch.com/press-release/global-hermetic-packaging-market
About Grand View Research
Grand View Research, Inc. is a
U.S. based market research and consulting company, registered in the State of
California and headquartered in San Francisco. The company provides
syndicated research reports, customized research reports, and consulting
services. To help clients make informed business decisions, we offer market
intelligence studies ensuring relevant and fact-based research across a range
of industries, from technology to chemicals, materials and healthcare.
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